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Expansion Features

This chapter describes the expansion features of the 17-inch PowerBook G4’s RAM expansion slots and the PC Card/CardBus slot.

In this section:

RAM Expansion Slots
PC Card/CardBus Slot


RAM Expansion Slots

The 17-inch PowerBook G4 ships with 512 MB of factory-installed SDRAM. The computer has two RAM expansion slots that accommodate standard SO (small outline) DIMMs using DDR SDRAM devices. The expansion slots are accessible for user installation of an additional SO-DIMM. Available as build to order options are 1 GB and 2 GB RAM.

The address logic for the RAM slots supports up to 2 GB total RAM. Using the highest-density devices currently available, an SO-DIMM can contain up to 1 GB of RAM, so the two RAM expansion slots can accommodate up to 2 GB total RAM.

Accessing the RAM Slots

The user can access the RAM expansion slots by removing the memory slot cover on the back of the computer, as shown in Figure 4-1. For complete instructions on accessing and replacing the RAM memory, refer to the 17-inch PowerBook G4 Getting Started guide that came with the computer.


Figure 4-1  Removing RAM expansion slot cover

Removing RAM expansion slot cover

Mechanical Design of DDR RAM SO-DIMMs

The RAM expansion modules used in the 17-inch PowerBook G4 are PC2700 DDR333 RAM SO-DIMMs, as defined in the JEDEC specifications.

The mechanical characteristics of the RAM expansion SO-DIMM are given in the JEDEC specification for the DDR SO-DIMM. The specification number is JEDEC JESD95. To obtain a copy of the specification, see the references listed at “RAM Expansion Modules.”

The specification defines SO-DIMMs with nominal heights of 1.0, 1.25, 1.5, and 2.0 inches. The 17-inch PowerBook G4 can accommodate SO-DIMMS with heights of 1.25 inches or less.

Important: The 17-inch PowerBook G4 can not accept a 1.5 or 2-inch SO-DIMM.

The JEDEC specification defines the maximum depth or thickness of an SO-DIMM as 3.8 mm. Modules that exceed the specified thickness can cause reliability problems.

Electrical Design of DDR RAM SO-DIMMs

SO-DIMMs for the 17-inch PowerBook G4 are required to be PC2700 compliant. For information about the PC2700 specifications, see the references at “RAM Expansion Modules.”

The electrical characteristics of the DDR RAM SO-DIMM are given in section 4.5.6 of the JEDEC Standard 21-C, release 7 (JESD-21C). To obtain a copy of the specification, see the references listed at “RAM Expansion Modules.”

The JEDEC and Intel specifications define several attributes of the DIMM, including storage capacity and configuration, connector pin assignments, and electrical loading. The specifications support SO-DIMMs with either one or two banks of memory.

Important: The memory controller on the 17-inch PowerBook G4 uses separate CKE signals for each bank, as called out in the JEDEC specification. SO-DIMMs that have all the CKE pins connected together do not operate properly.

The JEDEC specification for the SO-DIMM defines a Serial Presence Detect (SPD) feature that contains the attributes of the module. SO-DIMMs for use in PowerBook computers are required to have the SPD feature. Information about the required values to be stored in the presence detect EEPROM is in section 4.1.2.5 and Figure 4.5.6–C (200-pin DDR SDRAM SO–DIMM, PD INFORMATION) of the JEDEC standard 21-C specification, release 7.

Important: For a DIMM to be recognized by the startup software, the SPD feature must be programmed properly to indicate the timing modes supported by the DIMM.

Capacitance of the data lines must be kept to a minimum. Individual DRAM devices should have a pin capacitance of not more than 5 pF on each data pin.

DDR SDRAM Devices

The DDR SDRAM devices used in the RAM expansion modules must be self-refresh type devices for operation from a 2.5 V power supply. The data rate of the DDR SDRAM devices must be 333 MHz.

The devices are programmed to operate with a CAS latency of 2.5 or 3. At these CAS latencies, the access time from the clock transition must be +/- 0.6 ns or less for data strobes and +/- 0.7 ns for data lines. The burst length must be at least 4 and the minimum clock delay for back-to-back random column access cycles must be a latency of 1 clock cycle.

When the computer is in sleep mode, the RAM modules are in self-refresh mode and the maximum power-supply current available for each RAM module is 6 mA/128 MB (48 mA per RAM module) ;see the section “RAM SO-DIMM Electrical Limits.” Developers should specify DDR SDRAM devices with low power specifications so as to stay within that limit.

Configuration of DDR RAM SO-DIMMs

Table 4-1 shows information about the different sizes of DDR SDRAM devices used in the memory modules. The first two columns show the memory size and configuration of the SO-DIMMs. The next two columns show the number and configuration of the DDR SDRAM devices making up the memory modules.

Table 4-1  Sizes of RAM expansion modules and devices

SO-DIMM size

SO-DIMM configuration (MB x bits)

Number of devices

Device configuration (MB x bits)

Number of banks

128 MB

16 x 64

8

16 x 8

1

128 MB

16 x 64

8

8 x 16

2

256 MB

32 x 64

16

16 x 8

2

256 MB

32 x 64

8

32 x 8

1

256 MB

32 x 64

8

16 x 16

2

512 MB

64 x 64

8

64 x 8

2

512 MB

64 x 64

16

32 x 8

2

1 GB

128 x 64

16

64 x 8

2

Note: The 17-inch PowerBook G4 does not use memory interleaving, so installing two SO-DIMMs of the same size does not result in any performance gain.

Address Multiplexing

Signals A[0] – A[12] and BA[0] – BA[1] on each RAM SO-DIMM make up a 15-bit multiplexed address bus that can support several different types of DDR SDRAM devices. Table 4-2 lists the types of devices that can be used in the 17-inch PowerBook G4 by size, configuration, and sizes of row, column, and bank addresses.

Important: The 17-inch PowerBook G4 supports only the types of DDR SDRAM devices specified in Table 4-2. Other types of devices should not be used with this computer.

Table 4-2  Types of DRAM devices

Device size

Device configuration (bytes x bits x banks)

Row address bits

Column address bits

128 Mbits

4 M x 8 x 4

12

10

128 Mbits

2 M x 16 x 4

12

9

128 Mbits

1 M x 32 x 4

12

8

256 Mbits

8 M x 8 x 4

13

10

256 Mbits

4 M x 16 x 4

13

9

512 Mbits

16 M x 8x 4

13

11

512 Mbits

8Mx16x4

13

10

RAM SO-DIMM Electrical Limits

Each RAM SO-DIMM must not exceed the following maximum current limits on the 2.5 V supply:

Active: 1.2 A (8 devices at 150 mA each)

Sleep: 6 mA/128 MB (48 mA per RAM module)

Important: The restriction on sleep current is required not only to maximize the battery life but to meet the limitations of the backup battery during sleep swapping of the main battery. Developers of RAM expansion modules that exceed the limit on sleep current must include a warning to the user that battery sleep swapping may not work with those modules installed.

The Intrepid memory controller does not support 4-bit-wide SDRAM devices in any RAM expansion module.

PC Card/CardBus Slot

The PC Card/CardBus slot accepts one Type I or Type II card. The slot supports both 16-bit PC Cards and 32-bit CardBus Cards. The card can be removed and replaced while the computer is operating.

Note: The PC Card/CardBus slot does not provide 12 V power.



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© 2003, 2004 Apple Computer, Inc. All Rights Reserved. (Last updated: 2004-04-19)


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